[ Pobierz całość w formacie PDF ]
Notes
1. Value measured without influence of external circuitry.
2. Relative to phase at V17-9 = 3 V.
3. Or not connected.
4. The signal amplitude of the colour difference signals (R-Y) and (B-Y) is dependent on the characteristics of the
external tuned circuits at pins 7, 8 and 4, 5 respectively. Adjustment of the amplitude is achieved by varying the
Q-factor of these tuned circuits. The resonant frequency must be adjusted such that the demodulated output
frequency (fo) provides the same output level as the internally inserted reference voltage (achromatic value).
5. The sandcastle pulse is compared with three internal threshold levels, which are proportional to the supply voltage.
November 1984 8
Philips Semiconductors Product specification
TDA4555
Multistandard decoder
TDA4556
APPLICATION INFORMATION
November 1984 9
Fig.2 Application diagram.
Service switch
(a) colour ON; hue OFF
(c) colour ON; burst OFF
Philips Semiconductors Product specification
TDA4555
Multistandard decoder
TDA4556
PACKAGE OUTLINE
handbook, full pagewidth
DIP28: plastic dual in-line package; 28 leads (600 mil) SOT117-1
D ME
A2 A
L
A1
c
e w M
Z
b1
(e )
1
b
28 15 MH
pin 1 index
E
1 14
0 5 10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
(1)
A A 1 A 2 b b1 c D E e e1 L ME MH w Z
(1) (1)
UNIT
max. min. max. max.
1.7 0.53 0.32 36.0 14.1 3.9 15.80 17.15
mm
5.1 0.51 4.0 2.54 15.24 0.25 1.7
1.3 0.38 0.23 35.0 13.7 3.4 15.24 15.90
0.066 0.020 0.013 1.41 0.56 0.15 0.62 0.68
inches
0.20 0.020 0.16 0.10 0.60 0.01 0.067
0.051 0.014 0.009 1.34 0.54 0.13 0.60 0.63
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
REFERENCES
OUTLINE EUROPEAN
ISSUE DATE
VERSION PROJECTION
IEC JEDEC EIAJ
92-11-17
SOT117-1 051G05 MO-015AH
95-01-14
November 1984 10
seating plane
Philips Semiconductors Product specification
TDA4555
Multistandard decoder
TDA4556
SOLDERING
Introduction
There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and
surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for
surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often
used.
This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our
IC Package Databook (order code 9398 652 90011).
Soldering by dipping or by wave
The maximum permissible temperature of the solder is 260 °C; solder at this temperature must not be in contact with the
joint for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds.
The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the
specified maximum storage temperature (Tstg max). If the printed-circuit board has been pre-heated, forced cooling may
be necessary immediately after soldering to keep the temperature within the permissible limit.
Repairing soldered joints
Apply a low voltage soldering iron (less than 24 V) to the lead(s) of the package, below the seating plane or not more
than 2 mm above it. If the temperature of the soldering iron bit is less than 300 °C it may remain in contact for up to
10 seconds. If the bit temperature is between 300 and 400 °C, contact may be up to 5 seconds.
DEFINITIONS
Data sheet status
Objective specification This data sheet contains target or goal specifications for product development.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Product specification This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
November 1984 11 [ Pobierz całość w formacie PDF ]
zanotowane.pl doc.pisz.pl pdf.pisz.pl aikidobyd.xlx.pl
Notes
1. Value measured without influence of external circuitry.
2. Relative to phase at V17-9 = 3 V.
3. Or not connected.
4. The signal amplitude of the colour difference signals (R-Y) and (B-Y) is dependent on the characteristics of the
external tuned circuits at pins 7, 8 and 4, 5 respectively. Adjustment of the amplitude is achieved by varying the
Q-factor of these tuned circuits. The resonant frequency must be adjusted such that the demodulated output
frequency (fo) provides the same output level as the internally inserted reference voltage (achromatic value).
5. The sandcastle pulse is compared with three internal threshold levels, which are proportional to the supply voltage.
November 1984 8
Philips Semiconductors Product specification
TDA4555
Multistandard decoder
TDA4556
APPLICATION INFORMATION
November 1984 9
Fig.2 Application diagram.
Service switch
(a) colour ON; hue OFF
(c) colour ON; burst OFF
Philips Semiconductors Product specification
TDA4555
Multistandard decoder
TDA4556
PACKAGE OUTLINE
handbook, full pagewidth
DIP28: plastic dual in-line package; 28 leads (600 mil) SOT117-1
D ME
A2 A
L
A1
c
e w M
Z
b1
(e )
1
b
28 15 MH
pin 1 index
E
1 14
0 5 10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
(1)
A A 1 A 2 b b1 c D E e e1 L ME MH w Z
(1) (1)
UNIT
max. min. max. max.
1.7 0.53 0.32 36.0 14.1 3.9 15.80 17.15
mm
5.1 0.51 4.0 2.54 15.24 0.25 1.7
1.3 0.38 0.23 35.0 13.7 3.4 15.24 15.90
0.066 0.020 0.013 1.41 0.56 0.15 0.62 0.68
inches
0.20 0.020 0.16 0.10 0.60 0.01 0.067
0.051 0.014 0.009 1.34 0.54 0.13 0.60 0.63
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
REFERENCES
OUTLINE EUROPEAN
ISSUE DATE
VERSION PROJECTION
IEC JEDEC EIAJ
92-11-17
SOT117-1 051G05 MO-015AH
95-01-14
November 1984 10
seating plane
Philips Semiconductors Product specification
TDA4555
Multistandard decoder
TDA4556
SOLDERING
Introduction
There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and
surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for
surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often
used.
This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our
IC Package Databook (order code 9398 652 90011).
Soldering by dipping or by wave
The maximum permissible temperature of the solder is 260 °C; solder at this temperature must not be in contact with the
joint for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds.
The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the
specified maximum storage temperature (Tstg max). If the printed-circuit board has been pre-heated, forced cooling may
be necessary immediately after soldering to keep the temperature within the permissible limit.
Repairing soldered joints
Apply a low voltage soldering iron (less than 24 V) to the lead(s) of the package, below the seating plane or not more
than 2 mm above it. If the temperature of the soldering iron bit is less than 300 °C it may remain in contact for up to
10 seconds. If the bit temperature is between 300 and 400 °C, contact may be up to 5 seconds.
DEFINITIONS
Data sheet status
Objective specification This data sheet contains target or goal specifications for product development.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Product specification This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
November 1984 11 [ Pobierz całość w formacie PDF ]